QFN Package Process Flow: Advantages and Types
https://resources.pcb.cadence.com/blog/2023-qfn-package-process-flow-advantages-and-types
WebOct 2, 2023 · The abbreviation QFN stands for quad flat no-lead package. The main parts of a QFN package are a lead frame, single or multiple dies, wire bonds, and molding compounds. In the QFN packaging process flow, singulation can be by shear or saw process. A QFN package is a leadless package of surface mounting technology.
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